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Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Categories Liquid Gap Filler
Brand Name: AOK
Model Number: TF
Certification: RoHS, Reach, UL
Place of Origin: China
MOQ: 400ml(200ml each part)
Payment Terms: T/T
Delivery Time: 13-15 working days
Packaging Details: 50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Product Name: Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler
Composition: Ceramic filler + Silicone
Usage Temperature: -40 ℃ ~ 150 ℃
Dielectric Constant: 7.0(@10mhz)
Viscosity/Component A: 400000 (cps)
Viscosity/Component B: 400000 (cps)
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Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler


AttributeValueTest Method
CompositionCeramic filler + Silicone-
Color/Component AWhiteVisual
Color/Component BLight BuleVisual
Density(g/cc)3ASTM D792
Usage Temperature(℃)-40~150--
Electrical
Breakdown Voltage(kv/mm)≥7.0ASTM D149
Dielectric Constant(@10mhz)7.3ASTM D150
Volume Resistivity(Ω.cm)1.0*1013ASTM D257
FlammabilityV-0UL94
Thermal
Thermal conductivity(W/m.K)3.0ASTM D5470
Viscosity/Component A (cps)400000ASTM D2196
Viscosity/Component B (cps)400000ASTM D2196
Hradness,after cure(shore OO)40ASTM D22240

Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications


Typical applications


■Applications that require one-part dispensing
■Any design where vertical gap stability and no pump out are required
■Devices demanding low assembly pressure
■Automotive electronics (ADAS, HEV, NEV, batteries, ECU)
■Telecommunications
■Computer and peripherals
■Between heat-generating semiconductors and a heat sink

■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays


Two-part dispensable gap filler

TF Series Thermal Conductive Gap Filler products are two-component pre-formed thermally conductive silicone products, which mainly meet the requirements of low stress and high compressive modulus when the product is in use, and can realize automatic production; it has good contact with electronic products when assembling. A low contact thermal resistance and good electrical insulation characteristics. The cured thermally gap filler is equivalent to a thermally conductive pad, with good high temperature resistance and aging resistance, and can work for a long time at -40~200℃.


Purchase information
Packing specification: 50mL(25mL each part) / 400ml(200mL each part)/20kg (10kg each part)


Directions for use
• Working hours @ 25
C : 1 hour
• Dry to touch @ 25
C : 1 hour
• Full cure @ 25
C : 12-16 hours
• Full cure @ 100
C : 1 hour


Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.

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