Yamaha YSM10 full automatic pick and place machine
The YAMAHA YSM10 pick and place machine is an advanced automated
equipment used in the electronics manufacturing industry for
high-speed and accurate placement of electronic components onto
printed circuit boards (PCBs). It offers a range of functionality
and features that enhance efficiency, precision, and productivity
in the assembly process.
| Specifications | Smt Chip Mounter |
| Applicable PCB | L 510 x W 460mm - L 50 x W 50mm* Option: Up to L610 mm available |
| Mounting capability | 46,000CPH (The Company's optimum conditions) |
| Applicable components | 03015-W 55 x L 100mm (divided recognition for over W 45mm), H: 15mm
or less |
| Mounting accuracy | ±0.035 mm (±0.025 mm) Cpk≧1.0 (3σ) |
| Number of component types | Setting Plate : Max 96 types (8mm)Tray : 15 types (sATS 15
equipment) |
| Power supply | 3-phase AC 200/208/220/240/380/400/416 V ±10% 50/60 Hz |
| Air supply source | 0.45MPa or more, clean and dry state |
| External dimension | L 1,254 x W 1,440 x H 1,445mm (excluding protrusions) |
| Weight | 1,270kg |
Specifiaction:
| Model | YSM10 | YS12 | YS24 |
| Applicable PCB | L 510 x W 460mm - L 50 x W 50mm | L510x~W460mm to L50x~W50mm | L50mm x W50mm to L700mm x W460mm |
| Mounting Capability | 46,000CPH | 36,000CPH | 72,000CPH |
| Mounting Accuracy | ±0.035 mm (±0.025 mm) Cpk≧1.0 (3σ) | +/-0.05mm/CHIP | +/-0.05mm (μ + 3σ), +/-0.03mm (3σ) |
| Number of component types | 15 types (sATS 15 equipment, Max, JEDEC) | 120 types(Max, 8mm tape reel conversion) | 120 types (Max./8mm wide tape reel conversion) |
| Applicable components | 03015-W 55 x L 100mm, H: 15mm or less | 0402(Metric base) to □32*mm components | 0402 to 32x32mm max (Height 6.5mm or less) |
| External Dimensions | L 1,254 x W 1,440 x H 1,445mm | L 1,254 x W 1,440 x H 1,445mm | L1,254x W1,687x H1,445mm |
Functionality:
1. Component Placement: The YSM10 pick and place machine is
designed to precisely place a wide range of electronic components
onto PCBs. It utilizes robotic arms, vacuum nozzles, and vision
systems to pick components from feeders or trays and accurately
position them onto designated locations on the PCB. This feature
ensures precise component alignment and placement, minimizing the
risk of assembly errors.
2. High-Speed Placement: The machine is capable of high-speed
component placement, maximizing production throughput and
efficiency. It can achieve rapid pick-and-place operations,
allowing for fast assembly of PCBs and meeting high-volume
manufacturing requirements.
3. Component Compatibility: The YSM10 pick and place machine
supports a broad range of electronic components, including surface
mount devices (SMDs) such as resistors, capacitors, integrated
circuits (ICs), and various package types. It can handle components
of different sizes, shapes, and orientations, accommodating diverse
assembly requirements.
4. Vision System Integration: The machine often incorporates vision
systems for component alignment and inspection. The vision system
uses cameras and image processing algorithms to precisely align
components with solder pads on the PCB. It also allows for
real-time inspection of component placement accuracy, ensuring
quality control during the assembly process.
5. Multi-Head Placement: The YSM10 pick and place machine may
feature multiple placement heads. This enables simultaneous
placement of multiple components, further enhancing production
speed and efficiency. The multi-head configuration allows for the
assembly of complex PCBs with a high component density.
6. Programmable Control: The machine is equipped with programmable
control systems. It allows operators to define and adjust placement
parameters, such as pick-and-place positions, component
orientation, and speed profiles. This flexibility enables
customization to match specific PCB layouts and component
requirements, optimizing placement accuracy and productivity.
Usage Range:
The YSM10 pick and place machine is used in various applications
within the electronics manufacturing industry, including:
1. PCB Assembly: It serves as a key component in automated PCB
assembly lines. The machine facilitates the precise placement of
electronic components onto PCBs, ensuring efficient and accurate
assembly processes.
2. High-Volume Production: The YSM10 pick and place machine is
well-suited for high-volume production runs. Its high-speed
placement capability and efficient handling of diverse components
make it ideal for meeting large-scale manufacturing demands.
3. Surface Mount Technology (SMT) Assembly: The machine is commonly
used in surface mount technology assembly processes. It efficiently
handles SMD components and supports the assembly of complex PCBs
with densely populated components, such as those found in consumer
electronics, automotive, telecommunications, and other electronic
devices.
4. Multi-Product Manufacturing: The YSM10 pick and place machine is
suitable for multi-product manufacturing scenarios. It allows for
quick changeovers between different PCB designs or product
variants, enabling efficient production of diverse electronic
assemblies.
5. High-Precision Applications: The machine is utilized in
applications that require high placement accuracy, such as medical
devices, aerospace electronics, or high-end consumer electronics.
It ensures precise component alignment and placement, meeting the
strict quality standards of these industries.
The YAMAHA YSM10 pick and place machine plays a vital role in the
automated assembly of electronic components onto PCBs. It offers
high-speed, accurate, and flexible placement capabilities,
contributing to efficient production processes and ensuring
high-quality electronic assemblies.
Main features of Smt Chip Mounter
1) YAMAHA Pick and Place Machine Speed increases of 25% or more on
conventional models and achieving the world's fastest mounting
capacity,Based on the ideal concept 1-head solution capable of
handling a wide range of components while maintaining high speed
without the need for head replacement, we introduced various
technologies cultivated from upper model Z:LEX YSM20. By adopting
the latest technology such as the same lightweight and compact
universal type HM (High-Speed Multi) head as the upper model and
the new generation servo system, increases of 25% or more are
achieved compared with conventional machines (YS12) in the 1-Beam
1-Head machine class to realize a mounting capacity of the world's
fastest at 46000 CPH (in the Company's optimum conditions) At the
same time, it is versatile enough to handle from 03015 (0.3mm x
0.15mm) ultra-small chips to large components of 55mm x 100mm and
15mm in height.
In addition,YAMAHA Pick and Place Machine by improving the
performance of the scan camera, we have expanded the range of
component size compatibility for high-speed mounting from 8mm to
12mm.
2) Scalability for flexibly adjust to production site requirements
A range of options are available for selection including the
sATS15, an automatic replacement type tray component supply device,
the ANC, an auto nozzle station capable of automatically changing
nozzles, the multi camera which recognizes components exceeding
6.5mm in height or over 12mm square in size at high speed and high
precision.The tape feeder is supported by the electric intelligent
feeder SS feeder and ZS feeder used in the YS series.
3) Enhanced functionality to provide for table production
Pickup and recognition errors are suppressed along with reduced
loss in machine stoppage due the integration of the common
functionalities of the top machines of the Z:TA-R YSM40R and the
Z:LEX YSM20 with their e-Vision for automatically creating and
tracking components data, Smart Recognition for easily creating
components data from complicated shapes.
SMT Full Automatic High Speed Yamaha Chip Mounter YS12 YS12F YS24 YS24X YSM10 YSM20 pick and place machine
