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450W BGA Board SMT Assembly Line BGA Loading And Unloading Machine

Categories SMT Assembly Line
Brand Name: INFINITE™
Model Number: BLD-600A, BUL-600A
Place of Origin: China
MOQ: 1 unit
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Packaging Details: crate
Application: BGA board feeding operation in the semi conductor production line
Description: BGA Loading and Unloading Machine
Brand: INFINITE™
Model: BLD-600A, BUL-600A
Features: Magazine storage method, with automatic feeding function.
Warranty: 1 Year Warranty
Reliability: for Industrial use
Packaging: Wooden crate/box
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450W BGA Board SMT Assembly Line BGA Loading And Unloading Machine

450W BGA Board SMT Assembly Line BGA Loading And Unloading Machine


BGA Loading And Unloading Machine BGA Board Feeding Operation In The Semiconductor Production Line


INFINITE™ BGA Loading and Unloading Machine is a type of production equipment used for semiconductor packaging and testing, washing the front end of the line body, transferring the BGA board to the lower computer equipment through magazine storage with automatic feeding function. This BGA loading and unloading equipment is a required machine for BGA board feeding operation in the semiconductor production line. INFINITE™ BGA Loading and Unloading Machine adopts PLC control and an easy-to-operate touch screen control. Equipped by a servo motor for lifting and translation, lifting and transfer spacing can be set arbitrarily. INFINITE™ BGA Loading and Unloading Machine use a stepping motor as controller and the frame change method adopts the platform multi-frame storage method, with single-frame feeding and multiple-frame simultaneous feeding functions. Mechanical clamping type bin positioning method, which can adjust different size bins arbitrarily. Equipped with standard SMEMA communication port, which can communicate with other automation equipment.


Features:

  • Mainly used for semiconductor packaging and testing, washing the front end of the line body, transferring the BGA board to the lower computer equipment through the magazine storage method, with automatic feeding function.
  • The control system adopts PLC control.
  • The operation interface adopts a touch screen.
  • The lifting and translation are controlled by a servo motor, and the lifting and transfer spacing can be set arbitrarily.
  • Stepping motor controlled
  • The frame change method adopts the platform multi-frame storage method, with single-frame feeding and multiple-frame simultaneous feeding functions.
  • Mechanical clamping type bin positioning method, which can adjust different size bins arbitrarily.
  • Equipped with standard SMEMA communication port, which can communicate with other automation equipment.

TECHNICAL PARAMETERS
DescriptionThis equipment is used for the BGA board feeding operation in the semiconductor production line
Time feed PCB6.0-16 sec (or customer specified)
Power supplyAC220V±10V, 50/60HZ
Power450W
Air pressure4-6 bar up to 10 liters per minute
Transport height900±20mm (or customized)
Transport direction

From left to right or right to left


SPECIFICATIONS
ModelDimensionPCB sizeRack sizeWeightCircuit
(L*W*H MM)(MM)(L*W*H, MM)(KG)Board
thickness
BLD-600A1175*1000*1080 mm80*50-330*12050*80*100-300*150*400240Minimum
M/L/LL/XL0.2-2.0mm
thickness
BUL-600A1175*1000*1080 mm80*50-330*12050*80*100-300*150*400245Minimum
M/L/LL/XL0.2-2.0mm
thickness

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